Laboratory testing services

XRF is a quantitative and qualitative method that can be used to analyze solid and liquid materials. This method is intended for a standard screening of homogeneous materials that do not …

Imaging of the sample using a scanning electron microscope (SEM) with energy-dispersive X-ray spectroscopy (EDX or EDS). Typically, several images are taken with varying magnifications to get a good overview of the sample. An EDX mapping, line scan, or point measurement is …

Time-of-Flight Elastic Recoil Detection Analysis (ToF-ERDA) is an elemental analysis technique used for quantitative analysis of solids. The method is often used for depth profiling of thin films and bulk samples. Tof-ERDA is capable of detecting all elements and …

Imaging of the sample using scanning electron microscopy (SEM). Typically, several images are taken with varying magnifications to get a good overview of the sample. Non-conductive samples can be prepared with a metallic coating to allow imaging. For cross-section measurement, …

X-Ray Reflectometry (XRR) analysis is used to measure the density, thickness, and roughness of films. For film thickness measurements, the thickness should generally be below 300 nm (depending on the material) and the roughness should be low (<5 nm). If …

In this analysis, the surface roughness value (RMS) of the sample is determined with atomic force microscopy (AFM). The price includes three measurement points from the sample. The measurement area is 5 x 5 micrometers, if not agreed otherwise. In …

VPD ICP-MS allows the determination of trace metal contamination on the surface of wafers. The full surface of the wafer is scanned during the analysis. VPD ICP-MS is performed using acid to dissolve the top surface of the wafer before the determination of elemental concentrations …

Grazing Incidence X-ray diffraction (GI-XRD) measurement for determination of crystallographic structures, phases, and lattice parameters of crystalline thin films and surface layers. Typical Use Cases Thin film characterization in semiconductors and photovoltaics, …

Imaging of the sample with transmission electron microscopy (TEM) and determination of the elemental composition of the sample using electron dispersive X-ray spectroscopy (EDX or EDS). Several images with varying magnifications are taken to get a good overview of the sample. …

Ellipsometry is an optical technique that characterizes polarized light reflected from a sample's surface. It can measure the thickness or the refractive index of a layer. Do not hesitate to contact the method expert for more details.

Grazing Incidence X-ray diffraction (GI-XRD) measurement of thin films + X-ray reflectometry (XRR) analysis of thin films. Results include density (g/cm³), thickness (nm), and roughness (nm) values. For XRR, the thickness should generally be below 100 nm and …

Imaging of the sample with transmission electron microscope (TEM). Typically, several images with varying magnifications are taken to get a good overview of the sample. TEM allows nm-resolution images. Solid samples often require FIB preparation, which is not included in the price. …

XPS is a semi-quantitative technique that allows the measurement of the elemental composition of the surface of materials. In addition, it can also determine the binding state of the atoms. XPS is a surface-sensitive technique. Typical …

Secondary ion mass spectrometry (SIMS) is a highly sensitive elemental depth profiling method that can be used for a wide variety of solids to determine the presence of impurities or concentration of dopants. All elements from hydrogen to …

Total reflection X-ray fluorescence (TXRF) allows for surface elemental composition measurement. It is often used to map trace contaminations. Detection limit: 109 – 1011 at/cm2 Depth resolution: < 10 nm

In XPS depth profiling, ion gun etching cycles and XPS analysis cycles are alternated to obtain semi-quantitative information on the elemental composition (at.%) of the sample as a function of depth. The binding …

During this analysis, the surface of a smooth and hard sample is imaged with an atomic force microscope (AFM). Topological images are provided from several locations around the sample. The measurement area is 5 x 5 micrometers, if not agreed otherwise.

SAM is a non-destructive analysis technique used in failure analysis to obtain information on die-attach integrity, delamination, voids, cracks, and the effectiveness of bonding processes (including solder efficiency). Additionally, SAM can …

XPS is a semi-quantitative technique allowing to measure the elemental composition of the surface of materials. In addition, it can also determine the binding state of the atoms. If you wish to perform this test, please ask the …

Nano Scratch Test of thin film samples. Typical measurement includes overview image of the scratch track (surface damage) and determination of critical load values.

The Focused Ion Beam (FIB) technique is used to prepare samples for electron microscopy. It allows very precise cutting of samples to observe them by TEM or SEM imaging. The displayed price includes only the FIB preparation, but we are happy to …

High-resolution mass spectrometry (HRMS) is an analytical technique for determining the exact molecular masses of various compounds. The high accuracy makes HRMS ideal for the identification of molecular structures, ranging from small …

Nondestructive 3D analysis of internal structures by X-ray computed tomography. The method visualizes voids, cracks, density, and phase differences within solid structures. The method is most suitable for powdered materials, such as …

Measurement of surface profile, roughness or edge sharpness by optical profilometry.

Magnetometry provides information on the magnetic properties of the sample material as a function of the magnetic field. A vibrating-sample magnetometer (VSM), also referred to as a Foner magnetometer, is used in the …

Glow Discharge-Optical Emission Spectroscopy (GD-OES) is a quantitative technique used to profile the elemental composition of a sample in depth. The technique is mainly used for quick depth profiling of thick materials, thus providing their elemental composition as a …

Group delay dispersion (GDD) and group velocity dispersion (GVD) are critical parameters for understanding how the propagation time and speed of light pulses change with frequency or wavelength as they …

Hot-stage microscopy (HSM) analysis enables the direct visualization of materials under controlled temperature conditions. Capabilities include: Examining compound morphology and particle characteristics., Observing solid-solid transformations, …

Determination of metal concentrations on ALD thin films using LA-ICP-MS. The measurement includes the analysis of the following elements: Ag, Al, As, Au, B, Ba, Be, Bi, Br, Ca, Cd, Ce, Co, Cr, Cs, Cu, Dy, Er, Eu Fe, Ga, Gd, Ge, Hf, …

Particle size distribution (PSD) is determined from transmission electron microscopy (TEM) images. The method is most suitable for small particles of 50 nm or smaller. Depending on particle shapes, the method includes calculating the diameters or …

Rutherford Backscattering Spectrometry (RBS) can be used to measure the composition of solid samples quantitatively at the surface as well as depth profiling. RBS is used for the analysis of heavy elements and can be combined with ToF-ERDA when lighter elements also need to be …

Determination of B and P amounts in Borophosphosilicate glass.

The tests will be carried out with either standard EN 60068-2-1 (cold) or EN 60068-2-2 (hot), which establish procedures for evaluating the tolerance of components, equipment, or articles to cold and dry heat …

This analysis according to the IEC 60243-1 standard determines the dielectric strength of solid plastics by subjecting a flat sample plate to a gradually increasing voltage between two electrodes. The voltage …

Determination of metal concentrations on ALD thin films using LA-ICP-MS. The standard analysis package includes the quantification of the following elements: Ca, Cr, Cu, Co, Er, Fe, Ge, Pb, Mn, Mo, Ni, K, Na, Sn, Ti, Ta, Zn, …

The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The testing conditions simulate real-world scenarios where the equipment might encounter sudden, forceful impacts. …

The EN 60068-2-6 standard provides a procedure for assessing the ability of components, equipment, and other articles to withstand specified severities of sinusoidal vibration. The testing process includes preparing and mounting the …

This test is designed to evaluate a product's or component's ability to withstand dynamic loads without unacceptable degradation of functional and/or structural integrity when subjected to random vibration. Testing is …

Auger Electron Spectroscopy (AES) is used to analyze the elemental composition of materials. AES is a surface-sensitive technique (3-9 nm) which is used for depth profiling, providing analysis of the elemental composition in depth. Secondary electron …

Determination of a metal concentration on an ALD thin film using LA-ICP-MS. The measurement includes the analysis of one element, which is selected upon odering. Values will be reported in ppm (μg/g).

Automated thermal desorption-gas chromatography-mass spectrometry (ATD-GC-MS) is a highly sensitive method for wafer surface organic contamination analysis, providing low detection limits and a wide …