X-ray photoelectron spectroscopy (XPS) depth profiling

XPS depth profiling is the alternating between ion gun etching cycles and XPS analysis cycles.

The technique provides semi-quantitative information on the elemental composition (at.%) as a function of depth. The binding and electronic states of atoms can also be analyzed as a function of depth.

XPS depth profiling is a destructive technique with an analysis area diameter ranging from 10 µm to several 100 µm.

Suitable sample matrices
Thin films, coatings, films, stack, bulk materials
Typical turnaround time
4 weeks after receiving the samples
Detection limit
0.1 - 1 at.%
Available quality systems
Accredited testing laboratory
Device types

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