Laboratory testing services

Imaging of the sample using a scanning electron microscope (SEM) with energy-dispersive X-ray spectroscopy (EDX or EDS). Typically, several images are taken with varying magnifications to get a good overview of the sample. An EDX mapping, line scan, or point measurement is collected to measure the sample composition (elemental at.% or wt.%). Non-conductive samples can be prepared with a metallic coating. For cross-section measurement, additional preparation might be needed: FIB, BIB, or freeze fracturing.

Imaging of the sample using scanning electron microscopy (SEM). Typically, several images are taken with varying magnifications to get a good overview of the sample. Non-conductive samples can be prepared with a metallic coating to allow imaging. For cross-section measurement, additional preparation might be needed: FIB, BIB or freeze fracturing. If compositional analysis is also needed, please see the SEM-EDX measurement.

In this analysis, the surface roughness value (RMS) of the sample is determined with atomic force microscopy (AFM), typically with the Bruker Dimension Icon as the instrument. Three measurement points from the sample are included in a typical analysis. The measurement area is 5 x 5 micrometers, if not otherwise agreed. In addition to the RMS value, a 2D image, a 3D image, and raw data will be included in the test report.

Imaging of the sample with transmission electron microscopy (TEM) and determination of the elemental composition of the sample using electron dispersive X-ray spectroscopy (EDX or EDS). Several images with varying magnifications are taken to get a good overview of the sample. An EDX mapping, line scan, or point measurement is collected to measure the sample composition (elemental at.% or wt.%). For solid samples, the analysis often requires FIB preparation, which is priced separately. HR-TEM can also be provided. Contact us for more details about the analysis options.

The particle size distribution (PSD) and shapes of the particles are determined using image analysis. The method is suitable for particles sized 10 to 3,000 µm. Image analysis characterizes particle shapes, such as fibers, rods, and crystals, that cannot be analyzed meaningfully with traditional devices, such as laser diffraction or dynamic light scattering. Depending on the particle shapes, results typically include size distribution for length, width, and equivalent circular area (ECA) diameter.

Imaging of the sample with transmission electron microscope (TEM). Typically, several images with varying magnifications are taken to get a good overview of the sample. TEM allows nm-resolution images. Solid samples often require FIB preparation before analysis. HR-TEM can also be provided. Contact us for more details.

The focused ion beam (FIB) technique is used to prepare samples for electron microscopy. It allows very precise cutting of samples to observe them by TEM or SEM imaging. We are happy to provide a quote for FIB preparation on its own, as well as FIB-TEM or FIB-SEM analysis.

Broad Ion Beam (BIB) sample preparation enables the creation of surfaces or cross-sections that are ideal for imaging with scanning electron microscopy (SEM). This method utilizes a focused, high-energy ion beam to etch or mill the sample material with precision, ensuring minimal damage to the surface structure. Typical use cases Preparation of cross-sections for SEM to analyze thin films, coatings, and layered structures., Preparation of samples for SEM imaging of defects, grain boundaries, or interfaces in advanced materials.. Suitable samples Thin films deposited on various substrates, such as Si wafers, with thicknesses ranging from a few dozen nanometers to several micrometers., Bulk materials, including metals, ceramics, polymers, and composites., Samples requiring precise structural analysis without introducing thermal or mechanical damage.. Limitations Not suitable for materials with extreme sensitivity to ion bombardment., Limited applicability for very large samples due to equipment constraints., Potential for slight ion-induced alterations in ultra-sensitive materials.. Related techniques For site-specific thinning or preparation of samples for transmission electron microscopy (TEM), focused ion beam (FIB) sample preparation is used., Freeze fracturing can often be used for thin organic samples instead of BIB to save money..

SAM is a non-destructive analysis technique used in failure analysis to obtain information on die-attach integrity, delamination, voids, cracks, and the effectiveness of bonding processes (including solder efficiency). Additionally, SAM can assess the quality of sealing, coating, flip-chip underfills, wafer-to-wafer bonding, and solder bump integrity. In addition to conventional C-SAM, we offer the possibility of analysis with Gigahertz SAM (GHz-SAM), which offers increased resolution. Maximum scan area: 300 mm x 300 mm – 350 mm x 350 mm for conventional SAM, 100 µm – 1500 µm for GHz-SAM., Transducer frequencies: 5 MHz - 1 GHz (different devices) with theoretical resolution ranging from 100 µm to ~1 µm.. Please note that the maximum penetration depth depends on the acoustic properties of your specific material and the acoustic impedance differences between material layers. Contact our experts through the form below to request a quote for your C-SAM analysis project.

During this analysis, the surface of a smooth and hard sample is imaged with an atomic force microscope (AFM). Topological images are typically provided from three locations around the sample. The measurement area is 5 x 5 micrometers, if not otherwise agreed. Measurements are typically done using the following instrument: Bruker Dimension Icon.

Nondestructive 3D analysis of internal structures by X-ray computed tomography. The method visualizes voids, cracks, density, and phase differences within solid structures. The method is most suitable for powdered materials, such as pharmaceutical and cosmetic ingredients. The resolution can go down to 2-3 µm for powders. Please contact us for more information about the analysis options for different materials and material dimensions.

Optical microscopy uses visible light and lenses to magnify and image samples, providing a non-destructive way to examine surface features and structures. Optical microscopy is used to investigate surface morphology, grain boundaries, defects, and other structural details at a micrometer scale, with a resolution limit of ~200 nm. In a typical measurement, several images with varying magnifications are taken to get a good overall view of the sample. Typical use cases Quality control for surface defects, Microstructure analysis of metals, ceramics, and composites, Biological specimen imaging, Inspection of electronic components. Suitable samples Polished surfaces of metals or ceramics, Thin sections in resin (e.g. metallography), Transparent materials like tissues or thin films. Related techniques Confocal microscopy is suitable for the reconstruction of three-dimensional structures. Ask for an offer if you are interested..

The following analyses are included in this nanoparticle analysis package, intended to characterize nanoforms according to the REACH Regulation. Particle size distribution and aspect ratios by SEM-EDX Preparation with isopropanol, Sample dispersion on a slide, with centrifugation, SEM analysis and particle count by image analysis, Nanoparticle detection and classification according to the 2022 EC recommendation on the definition of nanomaterial, Reporting of PSD parameters for ~300 particles, including the following: PSD diagram, accumulated and individual., Feret min (min, d10, d25, d50, d75, d90, d95, max), Feret max (min, d10, d25, d50, d75, d90, d95, max), Equivalent circular diameter (min, d10, d25, d50, d75, d90, d95, max), Aspect ratio (calculated based on individual Feret min and Feret max measurements), Number based nano-fraction (%).. Crystal phase analysis by XRD/Rietveld method Sample preparation: drying, grinding, X-ray preparation, XRD analysis over an angular range extending from 10° to 90°, Identification of the crystalline phases present in the sample, Semi-quantitative analysis of phase distribution, using the Rietveld method, Interpretation of diffractograms. Chemical composition/purity by ICP-AES and CHNS analysis ICP-AES quantification of inorganic and metallic elements: Ag, Al, As, B, Ba, Be, Bi, Ca, Cd, Co, Cr, Cu, Fe, K, Li, Mg, Mn, Mo, Na, Ni, P, Pb, S, Se, Sb, Si, Sn, Sr, V, Zn, Ti, and Tl, Determination of C, H, N, and S with an elemental analyzer. Volume-specific surface area (VSSA) and VSSA diameter calculations (optional) BET specific surface area measurement of powder by nitrogen adsorption, True (skeletal) density measurement by He pycnometry, excluding intergranular and intragranular porosity, Both analyses include sample preparation. You can request a quote for the analysis using the form below. Please note that the OECD 125 guideline does not apply to this analysis.

Particle size distribution (PSD) is determined from transmission electron microscopy (TEM) images. The method is most suitable for small particles of 50 nm or smaller. Depending on particle shapes, the method includes calculating the diameters or lengths and widths of particles. In addition to size, TEM provides qualitative information about the surface morphology of the particles. TEM is a good option for irregularly shaped and non-spherical particles such as fibers, rods, and crystals that cannot be characterized meaningfully with traditional methods, including laser diffraction (LD) and dynamic light scattering (DLS). As a result of the analysis, TEM images and the determined particle size distribution for diameter (or length and width) are delivered. Dry samples are suitable for TEM as is. If the particles are wet or dispersed in a solvent, the sample may be dried with a suitable sample preparation method before imaging.

Electron backscatter diffraction (EBSD) is an SEM-based technique used to determine crystalline materials' crystallographic orientation, phase, and grain structures. The method is typically used for failure analysis and microstructure analysis of metals, ceramics, and alloys. Sample requirements: EBSD is suitable for flat, polished crystalline samples, including metals, ceramics, and thin films (50–500 nm). We offer polishing for rough samples. Non-conductive samples may require a conductive coating.

Hot-stage microscopy (HSM) analysis enables the direct visualization of materials under controlled temperature conditions. Capabilities include: Examining compound morphology and particle characteristics., Observing solid-solid transformations, melting/liquefaction, solidification, sublimation, and evaporation., Monitoring how different compounds interact, dissolve, or react with each other., Tracking crystal growth and growth rates., Utilizing the Kofler mixed fusion method for salt/co-crystal screening., Observing oxidation and other chemical reactions as they occur under heat.. The results will include microscope pictures and video showing the transitions during heating. Measurement specifications: Temperature range: 25 °C to 375 °C, Humidity control: 5–90% RH. Instrument details: The instrument set-up comprises a heating stage (hot stage) with a sample holder, coupled with a polarized-light microscope and a system that allows temperature measurements and video/picture recording.

Determination of inhalable and respirable dust fractions present in indoor air. The aerodynamic diameters of the inhalable and respirable dust particles are < 100 µm and < 4 µm, respectively. The price includes a sample collector and a sample pump, which are delivered to the customer for sampling. Results are reported as mg/m³. According to the Finnish Ministry of Social Affairs and Health's decree on Hazardous Concentrations (538/2018), the normative threshold value for inhalable dust is 10 mg/m3 on an eight-hour average concentration.