Semiconductor testing services

Measurlabs offers a comprehensive selection of semiconductor testing services for surface analysis, depth profiling, failure analysis, and structural characterization. In addition to test results, you will receive support from highly qualified and responsive method experts throughout the project.
Semiconductor testing services
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  • Personal service from method experts
  • Competitive prices
  • Result accuracy guarantee

Imaging techniques

We offer SEM, TEM, and AFM techniques for high-resolution imaging of semiconductor devices and components. In addition to the basic SEM and TEM setups, several additional detectors are available, including EDX for simultaneous elemental analysis and EBSD for visualizing crystalline structures. Cross-sectional analysis is also possible with FIB and BIB sample preparation.

For non-destructive imaging, we provide scanning acoustic microscopy (SAM), which is an excellent option for identifying cracks, voids, and delaminations in multilayer film stacks and printed circuit boards without the need to cut the sample. Micro-CT may also be used for some samples, although achieving a high enough resolution for semiconductor inspection often requires the sample to be cut.

Elemental composition analysis of semiconductors

Semiconductor elemental composition analysis

Measurlabs offers several options for determining the elemental composition of thin films and other semiconductor devices and materials, both at the surface and as a function of depth. Some of the available analysis techniques include the following: 

  • Tof-ERDA measurement for determining elemental concentrations with a detection limit below 0.5 atomic percentages – the technique is suitable for depth profiling and capable of detecting all elements, including differentiating between different isotopes of hydrogen.

  • SIMS measurement for detecting trace amounts (ppm to ppb level) of impurities on the surface and at different depths.

  • GD-OES for fast quantitative depth profiling without the need for a vacuum chamber – capable of detecting light elements.

  • VPD-ICP-MS for determining trace metal contaminations on the sample surface.

Determination of physical characteristics

We provide a range of methods for determining the thickness, roughness, density, and other physical properties of thin films and wafers used in semiconductor development. Some of the testing options include roughness measurements with atomic force microscopy, thickness measurements with XRR, and crystal structure determinations with GI-XRD.

Semiconductor failure analysis

Mechanical and thermal testing

Our service selection includes various measurements for assessing the durability of microelectronics, PCBs, electrical appliances, and components under specified types and intensities of mechanical stress, as well as in different temperature conditions. These include the following standardized tests:

You can contact our experts to request for more information and a quote for mechanical testing of semiconductor devices or components. The above are just a few examples of our capabilities, so do not hesitate to ask about other tests.

Customer service by semiconductor testing experts

When you order semiconductor testing services from Measurlabs, you will get access to a wide range of techniques in one place, reliable and clearly reported results, and support from skilled testing experts, who will take ownership of your current and future testing projects with us. Do not hesitate to contact us to learn more.

Request a quote

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Answering the following questions helps us prepare an offer for you faster:

  • How many samples do you have, and what is the sample material?

  • Which properties need to be analyzed?

  • Do you have (a) specific method(s) in mind? We can also help with method selection.

  • Do you have a recurring need for semiconductor testing? If yes, how often and for how many samples at a time?

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