VPD ICP-MS

VPD ICP-MS allows the determination of trace metal contamination on the surface of wafers. The full surface of the wafer is scanned during the analysis.

VPD ICP-MS is performed using acid to dissolve the top surface of the wafer before the determination of elemental concentrations with ICP-MS. Please note that lighter elements, such as H, C, N, O, and F, cannot be analyzed.

We offer different analysis packages for a wide range of elements:

• 30 elements: Al, As, B, Ba, Be, Bi, Ca, Cd, Co, Cr, Cu, Ga, Ge, Fe, K, Li, Mg, Mn, Mo, Na, Ni, Pb, Sb, Sn, Sr, Ti, W, V, Zn, Zr

• 41 elements: Al, As, B, Ba, Be, Bi, Ca, Cd, Co, Cr, Cs, Cu, Ga, Ge, Fe, Hf, Ir, K, Li, Mg, Mn, Mo, Na, Nb, Ni, Pb, Re, Sb, Sn, Sr, Ta, Te, Th, Ti, Tl, U, W, V, Y, Zn, Zr

• Additional noble metals: Ag, Au, Pt, Pd

• Additional elements are available upon request

• Detection limits are in the ppm–ppb range (10⁷–10¹⁰at/cm²)

This measurement is primarily intended for 100, 150, 200, and 300 mm bare-silicon wafers, but we also offer ICP-MS analyses for other wafer sizes and thin films.

The most typically used instruments include the following:

• Perkin-Elmer NexION 350S ICP-MS

• Perkin-Elmer Sciex ELAN 6100 DRC II ICP-MS

• Thermo Fisher iCAP TQe ICP-MS

• Finnigan element2 ICP-MS

Contact us for more information and to request a quote.