Scanning acoustic microscopy (C-SAM)

SAM is a non-destructive analysis technique used in failure analysis to obtain information on die-attach integrity, delamination, voids, cracks, and the effectiveness of bonding processes (including solder efficiency). Additionally, SAM can assess the quality of sealing, coating, flip-chip underfills, wafer-to-wafer bonding, and solder bump integrity.

In addition to conventional SAM, we offer the possibility of analysis with Ghz SAM, which offers increased resolution.

• Maximum scan area: 300 mm x 300 mm – 350 mm x 350 mm for conventional SAM, 100 µm – 1500 µm for Ghz SAM.

• Transducer frequencies: 5 MHz - 1 Ghz (different devices) with theoretical resolution ranging from 100 µm to ~1 µm.

Please note that the maximum penetration depth depends on the acoustic properties of your specific material and acoustic impedance differences between material layers.

Contact our experts through the form below to request a quote for C-SAM analysis.