X-ray photoelectron spectroscopy (XPS) depth profiling
In XPS depth profiling, ion gun etching cycles and XPS analysis cycles are alternated to obtain semi-quantitative information on the elemental composition (at.%) of the sample as a function of depth.
The binding states of atoms can also be analyzed as a function of depth to determine the chemistry of the sample and its variations with depth.
XPS depth profiling is a destructive technique with an analysis area diameter ranging from 10 µm to several 100 µm.
More information about the method:
X-ray photoelectron spectroscopy (XPS)- Suitable sample matrices
- Thin films, coatings, films, stack, bulk materials
- Typical turnaround time
- 2 – 3 weeks after receiving the samples
- Detection limit
- 0.1 - 1 at.%
- Available quality systems
- Measurlabs validated method
- Device types
- Method expert
Chemicals
Paper and board
Polymers and plastics
Semiconductors
Compositional analysis
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