TXRF measurement
Total reflection X-ray fluorescence (TXRF) measurement to determine elemental trace contamination on wafer surfaces.
49-300 individual spots are measured, and the elemental concentrations are given as visual heatmaps on the wafer surface as well as numeric concentrations.
Almost all elements between sodium (Na) and Uranium (U) can be included in the list of analyzed elements. Most typically, some or all of the following elements are included: Al, Mg, Na, Ag, Ar, Ba, Ca, Cd, Ce, Cl, Co, Cr, Cs, Cu, Dy, Er, Eu, Fe, Gd, Hf, Ho, I, In, K, La, Lu, Mn, Nd, Ni, P, Pd, Pm, Pr, Rh, S, Sb, Sc, Sm, Sn, Tb, Te, Ti, Tm, V, Xe, Yb, Zn, Ac, As, At, Au, Bi, Br, Fr, Ga, Ge, Hg, Ir, Kr, Mo, Nb, Os, Pa, Pb, Po, Pt, Ra, Rb, Re, Rn, Ru, Se, Sr, Ta, Tc, Th, Tl, U, W, Y, Zr.
All typical coated and bare wafers (e.g. Si, SiC, GaAs, GaN, InP, etc.) and sizes up to 300 mm (12 inch) are suitable for the measurement.
Detection limits vary between 109 - 1012 at/cm2. Transition metals have lower detection limits compared to alkaline and alkaline earth metals.
Spatial resolution is between 5-15 mm, depending on the wafer size and number of points measured.
Please contact us to get further information and prices.
More information about the method:
TXRF analysis- Suitable sample matrices
- All bare and coated wafers up to 300 mm in diameter.
- Required sample quantity
- Full wafer
- Typical turnaround time
- 1 – 3 weeks after receiving the samples
- Detection limit
- 10E9 - 10E12 A/CM2
- Available quality systems
- Measurlabs validated method
- Device types
- Method expert
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