Constant cold temperature or dry heat testing

The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. Testing conditions simulate real-world scenarios where the equipment might encounter sudden, forceful impacts. This is a destructive test intended for device qualification, carried out in accordance with JESD22-B110B. Example testing conditions: Pulse shape: saw-tooth curve , Acceleration: 100G , Duration: 2ms, The device is tested along 3 axes and subjected to one shock in both the positive and negative directions for each axis being tested, Service condition C.

This test is designed to evaluate a product's or component's ability to withstand dynamic loads without unacceptable degradation of functional and/or structural integrity when subjected to random vibration. Testing is carried out according to the IEC 60068-2-64 standard. The test applies to specimens that may be subjected to vibration of a stochastic nature, resulting from transportation or operational environments, for example, in aircraft, space vehicles, and land vehicles. Example testing conditions: Acceleration: 5.04 Grms, Time: 8hrs/axis, 3 axes. Test conditions will affect pricing, so please specify them in detail when requesting a quote.

Nano scratch test of thin film samples. Typical measurement includes an overview image of the scratch track (surface damage) and determination of critical load values.

The IEC 60068-2-6 standard provides a procedure for assessing the ability of components, equipment, and other articles to withstand specified severities of sinusoidal vibration. The testing process includes preparing and mounting the test sample similarly to its real-world use, setting up the vibration test system, which typically includes a vibration table, performing a predefined testing sequence, and monitoring the vibration response and critical behavior of the test sample. Example testing conditions: Acceleration: 5G (peak), Frequency: 5 Hz to 2,000 Hz , Measurement across 3 axes, 10 sweeps/axis.

X-Ray Reflectometry (XRR) analysis is used to measure the density (g/cm3), thickness (nm), and roughness (nm) of thin films. The method is applicable to the characterization of single- or multilayered thin films, as it provides information on the thickness and density of individual layers of the sample material as well as the roughness of the interphases. Greatest accuracy for XRR thickness measurements is generally achieved for samples containing 1-150 nm thick surface layers with under 5 nm RMS roughness. Thicker films and coatings with rougher surfaces can also be characterized, but the accuracy of thickness determination decreases as the thickness and roughness of the film or film stack increase. >150 mm wafers are typically cut to fit the sample holder. Please let us know if you need testing for larger wafers that cannot be cut into pieces. The available temperature range for XRR measurements is 25-1100 °C, and crystallinity can be studied as a function of temperature. The measurements can be performed under a normal atmosphere, inert gas, or vacuum. Measurements are typically performed using one of the following instruments: Rigaku SmartLab, Panalytical X'Pert Pro MRD, Bruker D8 Discover. Please let us know if you have a preference for a specific instrument.

This test is used to determine the folding endurance of paper or board using the Köhler-Molin, Lhomargy, MIT, and Schopper testers. During the test, a narrow strip of paper is folded forwards and backward in a standardized manner, so that it is subjected to longitudinal stress until it breaks.

During this analysis, the surface of a smooth and hard sample is imaged with an atomic force microscope (AFM). Topological images are typically provided from three locations around the sample. The measurement area is 5 x 5 micrometers, if not otherwise agreed. Measurements are typically done using the following instrument: Bruker Dimension Icon.

A dilatometer is used to determine the linear thermal expansion of a material as a function of temperature. The temperature range of the measurement is generally between 25 °C and 1,600 °C. There is also an option to perform the test in a cryogenic atmosphere, which ranges from -175 °C to 300 °C. The typical heating rate is 3 °C/min. As a result of the measurement, you will get the coefficient of thermal expansion (CTE) and the absolute change in sample length, both as a function of temperature. The testing can be performed in various atmospheres, including air, argon, CO₂, N₂, and O₂. Please contact us to get a quote. The price will depend on the testing conditions, so please specify them as precisely as possible.

We have various testing services available for ultrapure water. Pricing depends on the selected analyses and the number of samples. Please contact Measurlabs to get an offer. Note that we will provide suitable shipping containers based on the analyses that are ordered. Trace elements by ICP-MS For the determination of elemental impurities, we offer a basic 36-element and an extended 67-element package. The basic package includes the following 36 elements: Li, Be, B, Na, Mg, Al, K, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Sr, Zr, Nb, Mo, Ag, Cd, Sn, Sb, Ba, Ta, W, Pt, Au, Tl, Pb, and Bi. The extended analysis includes the following elements in addition to the basic package: Ce, Cs, Dy, Er, Eu, Gd, Hf, Ho, In, Ir, La, Lu, Hg, Nd, Os, Pd, Pr, Re, Rh, Rb, Ru, Sm, Sc, Se, Te, Tb, Th, Tm, U, Yb, and Y. Reporting limits depend on the element and sample matrix, but typically vary between 0.001 ppb and 0.6 ppb. For this analysis, samples must be delivered in Teflon containers. Hardness Hardness value can be calculated based on the ICP-MS results. Silicon and silica (Si, SiO2) Our service catalog includes the determination of total, dissolved, and colloidal silica (SiO2). Total silicon is analyzed using the ICP-OES technique, and dissolved silicon by UV-VIS (molybdenum heteropoly blue method). Colloidal silica is calculated as the difference between total silica and dissolved silica. Total organic and inorganic carbon (TOC and TIC) We offer TOC determination for ultrapure water samples with a 5 ppb quantification limit. For this analysis, samples must be delivered in certified 40 ml TOC vials. Total inorganic carbon (TIC) analysis can also be performed using a TOC analyzer. Anions by ion chromatography (IC) For anions, we have a basic package and a separate package for organic anions. The basic package includes the following anions: bromide(Br⁻), chloride (Cl⁻), fluoride (F⁻), nitrate (NO₃⁻), nitrite (NO₂⁻), phosphate (PO₄³⁻), and sulfate (SO₄²⁻). Analysis of organic anions includes: acetate, formate, glycolate, propionate, and butyrate. Reporting limits depend on the anion and sample matrix, but typically vary between 0.02 and 1 ppb for basic anions and are around 25 ppb for organic anions. For this analysis, samples must be delivered in HDPE bottles. Cations by ion chromatography (IC) The analysis package for cations includes the determination of the following cations: ammonium (NH4+), calcium (Ca2+), lithium (Li+), magnesium (Mg2+), potassium (K+), and sodium (Na+). Reporting limits typically vary between 2 ppb and 5 ppb. Samples must be delivered in HDPE bottles. PFAS compounds (24 compounds) Analysis includes PFOS, PFOA, PFNA, PFHxS, and 20 other selected PFAS compounds. The complete list of compounds can be provided upon request. The reporting limit is typically 1 ng/L. The sample must be delivered in a plastic PFAS-free bottle, preferably made from HDPE.

Bending stiffness testing is performed to evaluate cardboard's stiffness by measuring the resistance to bending with 4-point loading. The results express the bending stiffness of the material in the machine direction and the cross direction.