VPD-ICP-MS noble metal analysis, 300 mm wafer
Determination of trace metal contamination on silicon wafer surfaces. using VPD-ICP-MS. Noble metal analysis includes quantifying of following elements: Ru, Pd, Ag, Pt, and Au. Price is for 300 mm wafers.
More information about the method family:Vapour phase decomposition ICP-MS (VPD-ICP-MS)
- Suitable sample matrices
- Bare-silicon wafers
- Typical turnaround time
- 3 weeks after receiving the samples
- Quality system
- Accredited testing laboratory
- Method expert
Prices excluding VAT.