Cross-sectional high resolution TEM-EDX imaging + FIB preparation
Cross-sectional high-resolution TEM-EDX with focused ion beam (FIB) preparation is a powerful combination of sample preparation and imaging techniques.
A cross-section of the sample is prepared with a focused ion beam (FIB)
The sample is imaged with a high-resolution transmission electron microscope (HR-TEM)
The elemental composition of the sample is determined using electron dispersive X-ray spectroscopy (EDX).
More information about the method family:
TEM analysis (TEM)Cross-sectional TEM analysisFocused ion beam (FIB)- Suitable sample matrices
- Solid materials, thin film, silicon wafers, glass substrates, metals, etc.
- Typical turnaround time
- 3 weeks after receiving the samples
- Detection limit
- Sub-nm
- Available quality systems
- Measurlabs validated method
- Device types
- Method expert
Polymers and plastics
Semiconductors
Microscopy
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