Cross-sectional high-resolution TEM imaging + FIB preparation
The sample cross-section is prepared with a focused ion beam (FIB) and then imaged with a high-resolution transmission electron microscope (HR-TEM).
The resulting image resolution is very high, sub-nanometer scale.
More information about the method family:
TEM analysis (TEM)Cross-sectional TEM analysisFocused ion beam (FIB)- Suitable sample matrices
- Solid materials, thin films, silicon wafers, glass substrates, metals, etc.
- Typical turnaround time
- 3 weeks after receiving the samples
- Detection limit
- Sub-nm
- Available quality systems
- Measurlabs validated method
- Device types
- Method expert
Questions? We're happy to help.
Questions? We're happy to help.
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