ICP-MS for thin films on wafers
Determination of trace metal contamination in thin films on silicon wafers. Different methods can be used depending on the material and substrate.
We have package analysis for a wide range of elements and can also provide analysis for noble metals.
Elements such as H, C, N, O, or F cannot be analyzed by the ICP-MS method.
Please, contact our expert to discuss the feasibility of the measurement for your matrix and the elements packages we can provide.
More information about the method:
ICP-MS analysis- Suitable sample matrices
- Thin film or coating on wafer
- Required sample quantity
- 1 full wafer
- Typical turnaround time
- 2 weeks after receiving the samples
- Detection limit
- Ppm - ppb
- Available quality systems
- Accredited testing laboratory
- Device types
- Method expert
Questions? We're happy to help.
Questions? We're happy to help.
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